SigmaTech Metrology Solutions = Productivity Enhancement

Sigmatech offers a broad range of high precision metrology and inspection systems for the Semiconductor, MEMS, optical and other related industries for Production and R&D environments:

- Wafer Dimensional Metrology
Thickness, TTV, Bow, Warp measurement;
Wafer Characterization;
Layer thickness measurement;
Ultrathin wafer substrates,

- Wafer Surface Metrology
Roughness measurement
MEMS/Membrane thickness
Bumps dimensions
Film Thickness
Step Height, cavities
Non-destructive TSV etch depth.

News:

Next event:
2010 Semicon West:
Booth #5450 North Hall

Sigmatech announces: new UltraMap system for TSV etch depth measurement

Cost effective metrology solution with multifunction sensors tool

Sigmatech: 12 years of innovation in metrology