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 9600A-300:
Automatic Thickness Measurement System
Our 9600A-300
is the world's finest, fully automated dimensional metrology system
designed to handle 200mm and 300mm wafers. It combines an ultra
fast, robotic wafer handler with precise measurement stage to meet
tight specifications. This field-proven measurement system offers
high throughput on the most repeatable and accurate measurement
system for current and future semiconductor process control. The
widely anticipated 9600A-300
is ready for your production needs.
Benefits
- Robotic wafer handling
- Low Cost of Ownership
- Highest uptime
- Flexibility - 200mm and 300mm wafers
- Programmable stage for repeatable positioning
Features
- Manual station, semi-automated or cassette-to-cassette full
auto
- Wafer sizes - 200mm & 300mm
- Vertical stage for zero gravity
- 15 wafers/hr for 40 point measurement
- 2D & 3D mapping capability
- Wafer sorting capabilities
Measurement Specifications
- Resolution: 0.1 microns
- Sample Thickness: 150 microns to 3mm
- Warpage range: ±2500 microns (up to 5mm)
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