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 9600S:
Semiautomatic Thickness Measurement System
The SigmaTech 9600S
is a semiautomatic non-contact thickness measurement system for
semiconductor wafers. The 9600S combines
a non-contact pneumatic sensor with a precision computer-controlled
stage that is user programmable for specific measurement positions.
The 9600S allows the user to program
numerous recipes for a variety of substrates.
Features
- Programmable measurement points
- Wafer identification and tracking
- Selectable load and unload positions
- Measurement reports, thickness, bow, TTV
- Sample measurement availability
- Based on Microsoft® Windows®
Measurement specifications
- Resolution: 0.1 micron
- Accuracy: 0.5 micron
Standard Stage Specifications
- Y-Theta Coverage: 203 mm
- Precision: 3.0 microns
Options
- Y-Theta Coverage: 305 mm
- Flat Finder
- Printer for Reports
- Hole avoidance (also on automatic)
Benefits
- Robotic wafer handling minimizes risk of damage to fragile
materials.
- When capacitive and laser systems cannot be used, SigmaTech's
APBP Technology provides high yield and the lowest cost-of-ownership
in the industry.
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Programmable positioning stage gives you the control you require
for multiple metrology measurement.
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