SigmaTech UltraMap-100B

Benchtop, automated Thickness measurement system

• Cassette to cassette or manual loading
• Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
• Wafer 2” to 4” (50 to 100mm)
• Thickness range: 50um to 3mm
• Throughput up to 100W/hours
• 2D & 3D mapping capability
• SECS/GEM communication
• Automated calibration

Options

• Wafer prealigner
• HISCAN for Roughness and structures measurement

Applications

QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc…