SigmaTech UltraMap-200B

Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm.

• Dual white light chromatic coding probe technology with 10nm resolution
• Thickness range from 50um to 1mm
• Automated calibration
• Hiscan option for surface roughness and link profile measurement and other surface structures.

Applications

Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.