SigmaTech UltraMap-APBP

Automated Thickness measurement system

Cassette to cassette or manual loading Patented sensing technology with APBP (dual automated positioning backpressure probes)

• (20nm resolution)
• Wafer 2” to 12” (50 to 300mm) round or square
• Thickness range: 200um to 5mm
• 2D & 3D mapping capability
• SECS/GEM communication
• Automated calibration

Options

• Extended warp/bow range up to 5000um
• Wafer prealigner
• Samples with special shape (square, rectangle, round)

Applications

Thickness and shape measurement of wafers made of special materials: Ceramics, rough material, plastics, glass, packaging materialExtremely high warp/bow wafers (10mm range)