Applications
SigmaTech offers metrology solutions for a broad range of standard and specific applications in the field of semiconductor wafers, materials and optics.
- Conductive or non-conductive substrates
- Reflective or non reflective surfaces
- Polished or non polished wafers
- Wet or dry environments
- Round, square or rectangular shapes
- Sizes up to 300mm
- Non contact solutions with automated calibration
Standard Metrology Applications
- Wafer Characterization 2” to 12”
- Highly warped wafers (up to 10mm)
- Wafers on sawframe
- Ultrathin wafers/substrates
- Layer thickness measurements
- Solar cell metrology
Specific Applications – Surface Metrology
- TSV and deep trench mapping
- Membrane thickness measurement
- Roughness measurement
- Bump dimensions
- Surface structures
