Standard Product Applications

Bare wafer characterization for 2” to 12” wafers:
UltraMapTM systems can automatically handle and measure all types of wafers from 2” to 12” and provide in one pass, a full set of key parameters for wafer characterization: Thickness, TTV, TIR, LTV, FPD, Warp, BOW and SORI. 2D and 3D maps are generated with throughput up to 100Wph. UltraMapTM systems are in full compliance with SEMI standards, CE standards and SECS/GEM .

Highly warped wafers:
UltraMapTM S and 9600-S systems, due to their unique patented probe technology can automatically measure wafers with warp up to 10mm. (Extended range available). Ideal for engineering department and production control for stacks of wafers, bonded wafers and solar cells

Wafer on Saw frame, Multilayer wafers, SOI:
Thickness measurements for wafers mounted on saw frames and multi-layer wafers are measured automatically, using our unique IR Interferometric probe technology. Thickness range capability from 20um to 1mm. For Multi-layers wafers such as Si bonded to glass, the thickness of each layer can be measured as well as total thickness and warp.

Glass substrate and Wafer mounted on glass substrate:
Measurement of non-conductive as well as translucent material can be done. The system is used to automatically measure thickness and flatness of bare glass substrates with accuracy of 0.5µm. When measuring the thickness of a wafer mounted on a glass substrate, the system can use the substrate as reference.

Solar Wafers:
UltraMap 200B systems provide automatic measurement of all dimensional parameters for square 156mm solar wafers.