Applications:
Wafer characterization
All types and all materials
High volume production control
Spot Roughness control
Thickness of wafers on sawframe, Wafers with bumps, multiple layers thickness, ultrathin wafers, SOI
Non conductive materials
Non polished wafers
Non-clean environment, wet environment
Technology Overview
To provide optimized solution to customers applications, SigmaTech offers multiple gauging technologies on the same platform:
Today, SigmaTech has multiple system installations at many of the world’s leading semiconductor manufacturing companies and stands at the forefront of the dimensional wafer metrology industry. SigmaTech metrology systems provide exceptional reliability and low cost of ownership.
SigmaTech currently offers multiple gauging technologies that can be implemented to provide the optimal solution for virtually any customer application. White light confocal technology (WLC) is used for high throughput wafer characterization for a wide variety of substrate materials. White light spectral interferometry (WLI) is employed for measuring the depth and uniformity for many types of deep trenches and through silicon via (TSV) features. IR laser interferometry is used for measuring thicknesses of ultra-thin wafers or thicknesses of individual material layers in a stack. A specialized form of IR interferometry is also used for measuring TSV features with very high aspect ratios. Our SigmaTech patented APBP technology is still the best solution for measurement of substrates with rough or uneven surfaces.