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 9600A:
Automatic Thickness Measurement System
The SigmaTech 9600A
is an automatic, non-contact thickness measurement system for semiconductor
wafers and substrates. The 9600A
combines a non-contact pneumatic sensor with a precision computer-controlled
stage that is user programmable for specific measurement positions
and auto loading robot to handle the wafers or substrates.
Benefits
- Flexibility: 2" to 8" wafer size
- Fully automated system
- Robotic handling minimizes risk of wafer damage and increases
throughput
- SigmaTech's APBP Technology provides high yield and the lowest
cost-of-ownership in the industry.
- Programmable stage for repeatable positioning.
Features
- Programmable measurement points
- Wafer identification and tracking
- Robotic loading
- Measurement reports: thickness, bow TTV, warp and mapping
- Data upload and download, Windows 98 compatible
Measurement Specifications
- Resolutions: 0.1 micron
- Accuracy: 0.5 micron
Options
- Auto Sorting
- Flat Finder
- Printer for reports
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