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To provide optimized solution to customers applications, Sigmatech offers multiple gauging technologies on the same platform:

White Light confocal technology: Each wavelength of the white light spectrum is perfectly focused at a different distance from the lens, using the chromatic longitudinal aberration of the special probe. Only the perfectly focused wavelength is registered. This technology works on most wafer surfaces, polished and unpolished, and provide fast, accurate submicron accuracy.

IR laser interferometry technology: This technology uses the transmission property of IR light through material to measure by interferometry, the thickness of semiconductor samples. This technology allows to measure thickness of ultrathin wafers mounted on tape or thickness of multiple layers such as glass, plastic, epoxy and adhesives.

Backpressure technology: This patented technology (APBP) uses a regulated flow of clean, dry air or nitrogen to measure the position of a target with submicron accuracy. The backpressure created is a function of the distance between the tip of the orifice and the surface of the target.
This process, unlike other metrology approaches, is independent of the target material, its reflectivity, conductivity, surface finish and even works in wet or contaminated environment.

Non-Contact Optical profiling: This measurement technology uses non-contact, 3D scanning, white light and phase-shifting interferometry. With 1Angstrom vertical resolution and extremely powerful analysis software, it provides an extensive range of data and visualization.

Whatever are your metrology needs, Sigmatech has the optimal and cost effective solution.

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Applications:
Wafer characterization;
All types and all materials;
High volume production control;
Spot Roughness control







Applications:
Thickness of wafers on sawframe, Wafers with bumps, multiple layers thickness, ultrathin wafers, SOI







Applications:
Non conductive materials,
Non polished wafers,
Non-clean environment, wet environment










Applications:
Bumps, step height
Thin film thickness map
Surface topography
Sub nanometer roughnessSolder balls, cavities
Developed by ZEMA
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