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Sigmatech 9600A:
Automated Thickness measurement system:
Cassette to cassette or manual loading
Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution)
Wafer 2” to 12” (50 to 300mm) round or square
Thickness range: 200um to 5mm
2D & 3D mapping capability
SECS/GEM communication
Automated calibration
Options
Extended warp/bow range up to 5000um
Wafer prealigner
Samples with special shape (square, rectangle, round)
Applications: Thickness and shape measurement of wafers made of special materials: Ceramics, rough material, plastics, glass, packaging materialExtremely high warp/bow wafers (10mm range) |
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