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Sigmatech 9600S-IR-300:
Automated Thickness measurement system:
IR interferometry probe technology
Single or dual probes
manual loading
0.5um accuracy. O.1um resolution
Wafer 4” to 12” (50 to 300mm) round or square
Thickness range: 20um to 1mm
Flexible recipe generation
2D & 3D mapping capability
SECS/GEM communication
Options
Extended warp/bow range up to 5000um
Wafer prealigner
Samples with special shape (square, rectangle, round)
Applications:
Thickness and shape measurement of Wafers with backgrinding tape, wafer on sawframe, dies on tape, wafer with bumps, SOI, multiple layers, Bonded wafers
Thickness of Si, plastic, glass, adhesive layers |
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