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Sigmatech UltraMap-100:
Benchtop, automated Thickness measurement system:
Cassette to cassette or manual loading
Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
Wafer 2” to 4” (50 to 100mm)
Thickness range: 50um to 3mm
Throughput up to 100W/hours
2D & 3D mapping capability
SECS/GEM communication
Automated calibration
Options
Wafer prealigner
HISCAN for Roughness and structures measurement
Applications: QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc… |
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