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  Sigmatech UltraMap-300:

Automated Thickness measurement system:
Cassette to cassette or manual loading
Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
Wafer 4” to 12”  (100 to 300mm)
Thickness range: 50um to 3mm
Extended warpage range up to 5mm
Throughput up to 120W/hours
2D & 3D mapping capability
Full SECS/GEM compatibility
Automated calibration

Options
Edge gripper/non-contact handling
Extended warp/bow range up to 5000um
Wafer prealigner
Roughness measurement

Applications: High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping
 


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