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Sigmatech UltraSurf A3D:
Fully automated control on 200 and 300mm wafers,
Auto wafer alignment
Foup capabilities
Semi-automated sequence measurement500um piezo scanner (2mm optional)
field of view: 130umx100um up to 2.5mmx1.9mm
Objectives: x2.5, x5, x10, x20, x50, x100
Powerful 3D analysis software.
Applications: Semiconductor process control:
Bump size, bump coplanarity, step height, surface roughness, transparent film thickness mapping, surface topography, |
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