Products Non-Contact Dimensional Metrology Thickness, TTV, TIR, LTV, Bow, Warp, SORI, FPD, flatness Sigmatech UltraMap-300: White light chromatic coding probes Wafers 4” to 12”, Cassette to cassette or manual loading.  Full SECS/GEM compatible Applications: High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers Sigmatech UltraMap-100: Benchtop model: White light chromatic coding probes, Wafers 2” to 4”, Cassette to cassette or manual loading Applications: Small wafers production control, SiC, Sapphire, Glass, InP Sigmatech 9600S-IR-300: IR interferometry technology, Wafers 4” to 12”. Manual loadingApplications: wafers on sawframe, SOI, multilayers Sigmatech 9600A: APBP (backpressure technology) Wafer 4” to 12”,  Cassette to cassette or manual loading, SECS/GEM Applications: All non–silicon wafers, ceramics, glass, sapphire, non– controlled environments Sigmatech 9600M: APBP (backpressure technology) Manual system for wafer 2” to 12” Applications: Wafer thickness QA  and R&D labs. All material, all surfaceUltrathin material from 20um to 5mm SigmaTech customized systems: For non-standard applications. Metrology solutions with combined sensing technologies available     Surface Metrology & Inspection MEMS, Bumps, sub-nanometric roughness, cavity, solder ball, steps Sigmatech UltraSurf serie: Non-contact 3D Optical profilers White light and phase-shifting interferometry, non-contact 3D scanning Sigmatech UltraSurf M: Compact microscope for sub-nanometric measurement. Powerful analysis software. 500um range Applications: R&D labs for Step height, bump size, Roughness, surface topography Sigmatech UltraSurf P: Interferometric sensor for fast 3D measurement, up to 200mm sample handling capabilities, Powerful analysis software. Applications: Bump size, step height, film thickness, surface topography, roughness, MEMS (vibration analysis) Sigmatech UltraSurf SZ: Fully automated optical profiling system  for sub-nanometric measurement. Powerful analysis software. Applications: R&D labs and production environment. Step height, bump size, Roughness, surface topography, field stitching Sigmatech UltraSurf A3D: Fully automated wafer process control.Cassette to cassette or manual loading. 6”, 8” and 12” wafers            Auto wafer alignment Applications: production control. Step height, bump size, Roughness, surface topography, pattern dimension, transparent film and Photoresist thickness mapping

Services PM Service Agreements Our new service contracts are a promise of performance and uptime. The packages include a fast response to problems, prompt on-site service, and preventative maintenance to ensure accuracy and repeatability. Our PM Service Agreement includes preventative maintenance service on a quarterly or semiannual basis, and can also be customized to meet your specific requirements. Our Maintenance-Free Packages give you years of worry-free operation and maximum uptime. Details