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Glass substrate and Wafer mounted on glass substrate: Measurement of non-conductive as well as translucent material. The system is used to automatically measure thickness and flatness of bare glass substrates with accuracy of 0.5µm. When measuring the thickness of a wafer mounted on a glass substrate, the system can use the substrate as reference. |
Square wafers: UltraMapTM and  9600 systems provide automatic measurement of all standard parameters of square wafers (4”, 6” and 8” side). Systems are available for cassette to cassette operation or manual loading.
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Wet wafers and/or substrates: One of the many benefits
of the 9600A
system is that it allows measurement of samples in various
environmental conditions. The fine jet of dry air (or nitrogen)
clears the surface (at the point of measurement) of any liquid
or particles to provide precise repetitive measurements.
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Substrates with holes pattern: Substrates featuring holes (or wafer mounted on a substrates featuring holes are measured for thickness and flatness using our powerful software capabilities. |
Bumps and solder ball shape and dimension: image of a 200um high bump with 280um diameter as measured by our UltraSurf system.
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Wafers with bumps: Thickness and flatness of wafers with bumps can be measured automatically using the 9600S-IR-300 using IR Interferometry measurement technology. The system provide the true thickness of the base wafer. The wafer can be measured with the grinding tape still on. |
