Standard Production Applications

Bare wafers characterization 2” to 12”: UltraMapTM systems can automatically handle and measure all type of wafers from 2” to 12” and provide in one pass, the full set of key parameters for wafer characterization: Thickness, TTV, TIR, LTV, FPD, Warp, BOW, SORI, 2D and 3D maps with throughput up to 100Wph. UltraMapTM systems are in full compliance with SEMI standards, CE standards and SECS/GEM .

Highly warped wafers: UltraMapTM S and 9600-S systems, due to their unique patented probe technology can measure automatically wafers with warpage up to 10mm. (Extended range available). Ideal for engineering department and production control for stacks of wafers, bonded wafers, solar cells

Wafer on Saw frame, Multilayers wafer, SOI: Thickness Measurement wafers mounted on saw frame, as well as multi-layers wafer is measured automatically, using our unique IR Interferometric probe technology. Thickness range capability from 20um to 1mm. For Multi-layers wafers such as Si bounded on glass, thickness of each layer can be measured as well as total thickness and warpage.

MEMS, structures, bumps: Highly stable, precise measurement and inspection of fine structure on wafer surface is done using one of our UltraSurfTM System. Multiple set up capabilities and extremely powerful and interactive software provide an extensive range of data analyses and visualization

Roughness: Sub-nanometer roughness measurement with vertical resolution of 0.1nm. Extremely versatile as the system detects all types of materials. Non-contact and non-destructive measurement and no sample preparation for user friendly operation.